
Introduction:
Intel and other advanced companies formed a team for USB 3.0, aiming at R&D USB technology which is 10 times of the speed at present. Companies include Intel, HP, NEC, NXP semiconductor and Texas Instruments. Applications include PC, simultaneously transferring e.g. consuming and telecom products. As the increasing demand on digital media transferring------even more than 25GB, hi-speed simultaneous transferring becomes an inevitable need on performance. USB 3.0 has backward compatibility and traditional hot plug in/out.
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Features
> USB2.0 and USB1.1 compatible
> Speed reaches 10 times of that of USB 2.0. Transferring speed reaches 4.8GB/S
> Hi-speed, dual directional transferring;
> Power saving, quicker recharging for auto-recharge device;
> Hot plug in/out
> USB 3.0 30um plating; meet the requirement of UL94V-0
> Convenient installation, no need to install any software
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